Yesterday, a report emerged claiming that Intel is planning to release its upcoming 14-nanometer Broadwell architecture processors as a ball grid array (BGA) rather than an land grid array (LGA) package.
This would have several widespread implications, including bringing to an end to processor (CPU) upgrades.
Traditionally, the processors in desktop systems are fitted into a socket on the motherboard that allows them to be removed and replaced, while systems such as notebooks and tablets have the CPU soldered onto the motherboard.
At present, Intel uses the LGA package design, which allows the processor to either be fitted into a socket or soldered directly to a motherboard. This gives the OEM down the line options as to how to mount the processor onto the motherboard.
A switch to BGA would mean that the processor could no longer be fitted into socket where it could be removed or replaced, and instead would be soldered to the motherboard much like processors for notebooks and tablets are nowadays.
The rumor that Intel was planning a switch from LGA to BGA has been circulating for months, but earlier this week Japanese tech site PC Watch (translation here) was the first to break the news.
I have now independent confirmation from a PC building OEM, who declined to be named, along with two motherboard makers, that Intel has briefed them of the switch from LGA to BGA for Broadwell architecture processors, which are expected to make an appearance next year.